MLMTEK · 米豊米科技 · Taipei

Agentic AI
for invention.

MLMTEK is an AIP System — an agentic-AI engine that reads the public technical record at scale, finds the white space others miss, and turns it into defensible IP. Proven across a granted glass-substrate patent portfolio, as early as 2023.

AIP-PatentAIP-StrategyAIP-SHIELD TGV · UTG · CPO
The AIP System

Three agentic modules. One invention engine.

MLMTEK is not a single patent or a single tool. It is a system of agentic-AI modules that work from public information to invent, strategize, and protect.

A product can come from behind and win. A patent can't.
Priority goes to whoever files first — so the engine has to read the technology trend in real time, across your customers and competitors and the field beyond them, and turn it into filable IP before the window closes.
MODULE 01RUNNING

AIP-Patent

The agentic invention pipeline. Reads the public patent and technical record at scale, locates white space, and drafts reviewable, filable invention outputs — the engine behind MLMTEK's granted IP.

MODULE 02RUNNING

AIP-Strategy

The agentic strategic-intelligence layer. It reads the technology trend in real time — across your customers and competitors, and the field beyond them — continuously updating to surface white space, cross-reference patents and tech, verify by simulation, and point to the fastest path to PoC.

MODULE 03RUNNING

AIP-SHIELD

The agentic IP-integrity layer. Leak-prevention, provenance, and supplier-neutral evidence — so every invention output stays defensible and traceable.

How it works

From public signal to filed invention.

The engine reads the open technical record, maps where the white space is, and converts it into invention — verified by simulation and carried toward proof-of-concept. A repeatable pipeline, not a one-off idea.

ObserveLocateInventVerifyDeploy
Proof · the engine's output

Three proof outputs — across inspection, structure, and process.

These are not three unrelated patents. They are evidence that MLMTEK's AIP engine located glass-substrate white space and converted it into reviewable, granted IP — across the three hardest layers of advanced packaging, as early as 2023, before AI-assisted invention was mainstream.

Inspection · first deployable module

LCIR

Liquid-crystal fill + cross-polarized imaging reveals defects inside transparent TGV holes — complementary to AOI.

Makes in-hole TGV defects visible to standard AOI — fast, high-contrast, full-field.
Granted Taiwan invention patent · China / US applications pending
Structure

HDN — coaxial decoupling via

Coaxial decoupling-capacitor through-via with an engineered composite core — axial-dominant heat path and CTE-matched buffering.

Decoupling, axial heat extraction, and CTE buffering — in one through-via.
Taiwan patent application pending
Process

GOC — ultra-thin glass

Reversible bonding enables direct laser drilling of glass below 100 µm, then low-stress debond and carrier reuse.

Foundational to UTG-on-carrier processing — sub-100 µm glass made manufacturable.
Granted Taiwan invention patent · China / US applications pending
GRANTED · TW   Invention & utility-model IP across inspection, process, and structure.
PENDING   Corresponding applications in progress in the United States and China.
Selected proof outputs shown — MLMTEK’s full glass-substrate & CPO portfolio includes further granted and pending patents not listed here.
Focus domains

Where the engine works.

TGV

Through-Glass Via

Via formation, quality, and pre-metallization inspection.

UTG

Ultra-Thin Glass

Sub-100 µm processing and direct-drilling routes.

AP

Advanced Packaging

Structure, interconnect, passives, and thermal.

CPO

Co-Packaged Optics

Glass as a substrate for optical integration.

By the numbers
0+
Glass & CPO inventions
0
Proof dimensions
0
Focus domains
2023
Inventing with AI since
Contact
For technical, IP, or collaboration enquiries.

MLMTEK works from public information and engages on a confidential basis where appropriate.

MLMTEK · 米豊米科技
Taipei, Taiwan
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